I work as technician in a Singapore semiconductor factory. Here I share my working life as technician.
the gold deposition peeling off.
The seasoning wafers that get peeled off need to gathered and do analysis soonest possible.
The peeling can fly off anywhere, and the most sticking could be those with contact with chamber, eg the wafer holders. All the wafer holders need to change with new assembled.
Another big problem with peeling is, you have to vent out the chamber and do the cleaning. As you can see photo below, the peeling already stick back to the target itself. If this peeling is not cleared off, the deposition will not get uniformed deposited onto the wafers and affect the film property. And next leading to wafer scrappage.
