In his IFA 2018 keynote titled “The Ultimate Power of Mobile AI”, Huawei Consumer Business Group CEO Richard Yu introduced the Kirin 980, the system on a chip (SoC) that will bring about the next evolution of mobile AI. As the world’s first commercial SoC manufactured with Taiwan Semiconductor Manufacturer Company’s (TSMC) 7nm process, Kirin 980 combines best-in-class performance, efficiency, connectivity features, and Dual NPU AI processing power.
“Last year, we showed the world the potential of On-Device AI with the Kirin 970, and this year, we’ve designed an all-around powerhouse that not only features outstanding AI capabilities but also brings cutting-edge raw performance to consumers,” said Yu. “Equipped with all-new CPU, GPU and Dual NPU, the Kirin 980 is the ultimate engine to power next-generation productivity and entertainment applications.”
The cutting-edge TSMC 7nm process technology enables Kirin 980 to pack 6.9 billion transistors within a 1cm2 die size, 1.6 times of the previous generation. Compared to the 10nm process, the 7nm process delivers 20 per cent improved SoC performance and 40 per cent improved SoC power efficiency.
Read more : https://www.gadgetvoize.com/2018/08/31/huawei-launches-kirin-980-at-ifa-2018/