The leaked chip design reveals the presence of Through-Silicon Vias (TSVs) in the processor, a key indicator of stacked cache memory (3D V-Cache). This technology allows AMD to increase the amount of cache between Zen 5 cores, significantly boosting performance, especially in gaming and cache-heavy workloads.
https://hoo.be/boss-man-na-kap-lekha-tua-tueng-ep10
https://dearmysecretary-ep10-thaiversion.getmorphic.com/
https://hoo.be/the-witch-ep3-thai-sub
https://the-witch-ep3-thaidub.getmorphic.com/
https://hoo.be/gelboys-ep3-uncut
https://gelboys-ep3-uncut.getmorphic.com/
https://nezha-2-tw.creator-spring.com/
https://papaly.com/categories/share?id=e828eb5509c34416b2e1ef9fee73acd2
https://raindrop.io/cysrs/skdfk-52719011
https://x.com/yusuf_dybala/status/1892985092357882095
